印制板用光成像耐电镀抗蚀剂 Photoimageable plating and etching resist for printed circuit board  ICS  31.030 CCS  L 90   中华人民共和国国家标准 GB/T 29846—2025 代替 GB/T 29846—2013 2025-08-0 1发布 2026-02-0 1实施     国家市场监督管理总局 国家标准化管理委员会 发 布目　　次 前言   ·····································································································   Ⅲ 1     范围   ··································································································   1 2     规范性引用文件   ······················································································   1 3     术语和定义   ···························································································   1 4     要求   ··································································································   2      4.1     成像前   ···························································································   2      4.2     成像后   ···························································································   3 5     试验方法   ······························································································   4      5.1     试样   ······························································································   4      5.2     外观和尺寸   ······················································································   6      5.3     液态耐电镀抗蚀剂的粘度   ········································································   6      5.4     液态耐电镀抗蚀剂的细度   ········································································   7      5.5     最小线宽和线间距   ···············································································   7      5.6     耐电镀性和耐化学镀性   ··········································································   7      5.7     抗蚀刻性   ·························································································   7      5.8     封孔性   ···························································································   7      5.9     色差   ······························································································   7      5.10     显影时间   ························································································   7      5.11     退膜时间   ························································································   7      5.12     填充能力   ························································································   7 6     检验规则   ······························································································   7      6.1     检验条件   ·························································································   7      6.2     检验分类   ·························································································   7      6.3     型式检验   ·························································································   8      6.4     出厂检验   ·························································································   9 7     标志、包装、运输和贮存   ············································································   9      7.1     标志   ······························································································   9      7.2     包装   ·····························································································   10      7.3     运输   ·····························································································   10      7.4     贮存   ·····························································································   10 参考文献   ································································································   11 GB/T 29846—2025     Ⅰ 前　　言 本文件按照GB/T 1.1—2020《标准化工作导则　第1部分：标准化文件的结构和起草规则》的规 定起草。 本文件代替GB/T 29846—2013《印制板用光成像耐电镀抗蚀剂》，与GB/T 29846—2013相比， 除结构调整和编辑性改动外，主要技术变化如下： 范围中删除了光成像抗电镀剂，增加了光成像耐化学镀抗蚀剂（见第1章，2013年版的第1章）； a） 增加了耐电镀抗蚀剂、耐化学镀性、干膜光致抗蚀剂、液态光致抗蚀剂、高密度互连印制板、 封装基板的术语和定义（见3.1、3.5~3.9），删除了辊涂、无图形网印、浸涂、曝光能量、