论文标题
CLIC顶点和跟踪探测器的研发
R&D for the CLIC Vertex and Tracking detectors
论文作者
论文摘要
已经取得了重大进展，以开发硅像素技术，用于在拟议的紧凑型线性撞机（CLIC）检测器设计的顶点和跟踪器区域中使用。该线性加速器产生的电子峰值碰撞为内部检测器提供了干净，低辐射的环境。但是，物理驱动的性能目标，clic束结构以及来自光束引起的背景的占用率对该区域的探测器技术提出了挑战。 A pixel pitch down to 25 x 25$μ$m$^{-2}$, material budget $\leq$ 0.2-2$\%X_0$ per layer, average power dissipation of down to 50mWcm$^{-2}$, position resolution of 3-7$μ$m, and timing resolution as low as 5ns are called for in the vertex and tracking detectors.为此，正在进行一项全面的研发计划，以设计和测试硅像素探测器，以满足这些规格，包括整体设备和混合设备。这些研究涉及AllPix $^2 $ MONTE CARLO和TCAD模拟，高级ASIC和传感器设计，实验室测试以及单个模块的光束测试，以确定所需的性能参数。这些设备的表征和仿真建模也导致了CLIC检测器和物理（CLICDP）协作中一组工具和软件的开发。该出版物将鉴于CLIC顶点和跟踪探测器的要求，例如各种单片CMOS传感器，以及带有平面传感器的精细倾斜混合组件，该出版物将介绍正在开发和测试的技术的最新结果。
Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear accelerator provide a clean, low-radiation environment for the inner detectors. However, physics-driven performance targets, the CLIC beam structure, and occupancies from beam-induced backgrounds place challenging requirements on detector technologies for this region. A pixel pitch down to 25 x 25$μ$m$^{-2}$, material budget $\leq$ 0.2-2$\%X_0$ per layer, average power dissipation of down to 50mWcm$^{-2}$, position resolution of 3-7$μ$m, and timing resolution as low as 5ns are called for in the vertex and tracking detectors. To this aim, a comprehensive R&D programme is ongoing to design and test silicon pixel detectors to fulfil these specifications, including both monolithic and hybrid devices. These studies involve Allpix$^2$ Monte Carlo and TCAD simulations, advanced 65nm ASIC and sensor design, laboratory testing, and beam tests of individual modules to determine the required performance parameters. The characterisation and simulation modelling of these devices has also lead to the development of a set of tools and software within the CLIC detector and physics (CLICdp) collaboration. This publication will present recent results from the technologies being developed and tested in view of the CLIC vertex and tracking detector requirements, such as various monolithic CMOS sensors, and fine pitch hybrid assemblies with planar sensors.
