论文标题

降低散装掺杂对BI基3D拓扑绝缘子的运输特性的影响

Reducing the impact of bulk doping on transport properties of Bi-based 3D topological insulators

论文作者

Jafarpisheh, Shaham, Ju, An, Janßen, Kevin, Taniguchi, Takashi, Watanabe, Kenji, Stampfer, Christoph, Beschoten, Bernd

论文摘要

自理论预测以来,在基于BI的三维拓扑绝缘子中观察到螺旋表面状态一直是一个挑战。当费米水平由于无意的掺杂而深入到散装带中时,主要问题就会引发。这会导致大体的金属传导,该传导主要主导运输测量值并阻碍这些实验中表面状态的探测。在这项研究中,我们研究了各种策略,以减少基于BI的拓扑绝缘子中残留掺杂。 Bi $ _2 $ SE $ _3 $和BI $ _ {1.5} $ sb $ _ {0.5} $ TE $ _ {1.7} $ _ {1.7} $ SE $ _ {1.3} $的片段是由物理蒸气沉积及其结构和电气的生长与机械渗透的薄片相比,将其与物理蒸气沉积及其结构和电气相提并论。使用拉曼光谱法,我们探讨了底物在此过程中的作用,并提供了制造高质量晶体的最佳条件。尽管有这种改善,但我们表明蒸气相沉积的薄片仍患有结构性障碍,这导致了大体的残留N型掺杂。使用磁量测定,我们表明去角质薄片具有更好的电性能,因此对于探测表面状态的表面效果更有希望。

The observation of helical surface states in Bi-based three-dimensional topological insulators has been a challenge since their theoretical prediction. The main issue raises when the Fermi level shifts deep into the bulk conduction band due to the unintentional doping. This results in a metallic conduction of the bulk which dominates the transport measurements and hinders the probing of the surface states in these experiments. In this study, we investigate various strategies to reduce the residual doping in Bi-based topological insulators. Flakes of Bi$_2$Se$_3$ and Bi$_{1.5}$Sb$_{0.5}$Te$_{1.7}$Se$_{1.3}$ are grown by physical vapor deposition and their structural and electronic properties are compared to mechanically exfoliated flakes. Using Raman spectroscopy, we explore the role of the substrate in this process and present the optimal conditions for the fabrication of high quality crystals. Despite of this improvement, we show that the vapor phase deposited flakes still suffer from structural disorder which leads to the residual n-type doping of the bulk. Using magneto-measurements we show that exfoliated flakes have better electrical properties and are thus more promising for the probing of surface states.

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