论文标题
通过粘结碳链减少重叠石墨烯的界面热电阻
Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains
论文作者
论文摘要
探索界面热传输的机制并减少界面热阻力对于热管理和调制非常重要。在此，通过进行分子动力学模拟，通过添加键合碳链来大大降低了重叠石墨烯纳米纤维之间的界面热电阻。并且分析模型（跨接口模型，CIM）用于分析和解释交叉接口处的二维热传输机理。由于石墨烯纳米容器仅由一个碳链粘合，因此发现了界面热电阻的数量级降低。有趣的是，随着碳链数量的增加，界面热电阻的降低速度逐渐减慢，这可以通过基于CIM的理论关系来解释。此外，通过比较CIM和传统的简化模型，CIM的准确性在重叠的石墨烯纳米容器中得到了验证和证明。这项工作为改善界面热传输提供了一种新的方法，并揭示了用于热管理中应用的低维材料的基本机制。
Exploring the mechanism of interfacial thermal transport and reducing the interfacial thermal resistance is of great importance for thermal management and modulation. Herein, the interfacial thermal resistance between overlapped graphene nanoribbons is largely reduced by adding bonded carbon chains by performing molecular dynamics simulations. And the analytical model (cross-interface model, CIM) is utilized to analyze and explain the two-dimensional thermal transport mechanism at cross-interface. An order of magnitude reduction in interfacial thermal resistance is found as the graphene nanoribbons are bonded by just one carbon chain. Interestingly, the decreasing rate of interfacial thermal resistance slows down gradually with the increasing of the number of carbon chains, which can be explained by the proposed theoretical relationship based on CIM. Moreover, by the comparison of CIM and traditional simplified model, the accuracy of CIM is verified and demonstrated in overlapped graphene nanoribbons. This work provides a new way to improve the interfacial thermal transport and reveal the essential mechanism for low-dimensional materials applied in thermal management.
