论文标题
扩张 - 塑性为大分子转运的新机械途径跨过聚合物界面，产生固态粘结
Dilatational-Plasticity Opens a New Mechanistic Pathway for Macromolecular Transport Across Polymeric Interfaces Yielding Solid-State Bonding
论文作者
论文摘要
在几种工业应用中，聚合物界面之间的键合被广泛遇到。这些键合过程中的许多依赖于在熔体状态下振兴的时间耗时和温度依赖性的经典机制。在这里，我们首次报道了一种新的机械途径，通过通过机械变形触发快速的大分子加速度来实现固态聚合物键合。大规模的分子模拟表明，玻璃状聚合物的活性塑性变形，在温度良好的情况下，散装（和表面）玻璃过渡温度足以引起聚合物链的分段翻译，从而导致种族间插孔，并形成新的纠缠。这种新型键合的基本机理基础被确定为增强的分子尺度扩张（或致密性）与塑性变形过程中加速的分子迁移率一起。报道的机械见解开放了有希望的途径，用于设计新的粘结技术或材料系统，以及对现有的粘合技术的转换，以实现快速且能量较低的密集键合。
Bonding between polymeric interfaces is encountered widely in several industrial applications. Many of these bonding processes rely on time-consuming and temperature-dependent classical mechanism of polymer interdiffusion via reptation in a melt state. Here, for the first time, we report a new mechanistic pathway for achieving solid-state polymer bonding by triggering rapid macromolecular acceleration through mechanical deformation. Large-scale molecular simulations reveal that active plastic deformation in glassy polymers, at temperatures well-below the bulk (and surface) glass transition temperatures, is sufficient to cause segmental translations of the polymer chains that lead to interfacial interpenetrations, and formation of new entanglements. The underlying mechanistic basis for this new type of bonding is identified as enhanced molecular-scale dilatations (or densifications) in conjunction with accelerated molecular mobility during plastic deformation. The reported mechanistic insights open promising avenues for designing new bonding technologies or material systems, and transformation of the existing ones to achieve quick and energetically less intensive bonding.
