论文标题
在硅芯片上对三维纠缠的实验性最佳验证
Experimental optimal verification of three-dimensional entanglement on a silicon chip
论文作者
论文摘要
高维纠缠对于量子物理学的基本研究很重要,并在各种量子信息处理(QIP)任务中具有独特的优势。集成的量子设备最近成为创建,处理和检测复杂的高维纠缠状态的有前途的平台。朝着实用量子技术迈出的至关重要的一步是验证这些设备是否可以通过最佳策略可靠地工作。在这项工作中,我们使用硅光子芯片上的局部投影测量值对三维最大纠缠状态实现了最佳的量子验证策略。从1190个副本中实现了95%的置信度,以验证目标量子状态。获得的不忠作为副本数量的范围为-0.5497+-0.0002,超过248个标准偏差的标准量子限制为-0.5。我们的结果表明,量子状态验证可以作为复杂量子测量任务的有效工具。
High-dimensional entanglement is significant for the fundamental studies of quantum physics and offers unique advantages in various quantum information processing (QIP) tasks. Integrated quantum devices have recently emerged as a promising platform for creating, processing, and detecting complex high-dimensional entangled states. A crucial step towards practical quantum technologies is to verify that these devices work reliably with an optimal strategy. In this work, we experimentally implement an optimal quantum verification strategy on a three-dimensional maximally entangled state using local projective measurements on a silicon photonic chip. A 95% confidence is achieved from 1190 copies to verify the target quantum state. The obtained scaling of infidelity as a function of the number of copies is -0.5497+-0.0002, exceeding the standard quantum limit of -0.5 with 248 standard deviations. Our results indicate that quantum state verification could serve as an efficient tool for complex quantum measurement tasks.