论文标题
构建方向对E-PBF制造的纯CU机械和电气性能的影响
Effect of the build orientation on mechanical and electrical properties of pure Cu fabricated by E-PBF
论文作者
论文摘要
电导体通常由纯铜制成,因为该材料显示出出色的电导率(IACS> 100%)。添加剂制造可用于进一步改善此类电导体的性能,因为它可以考虑通过常规处理路线(例如铸造,加工或热形成)来制造复杂的几何形状。在目前的工作中,对电子束粉末床融合进行了优化,以实现致密的纯铜样本(相对密度> 99.9%)。在样品中,仅检测到从X射线微传输的样品中检测到的少量残留的球形孔,X射线显微图像学扫描很好地揭示了。产生了三个不同的构建方向,即0 {\ textDegree},45 {\ textDegree}和90 {\ textDegree}相对于构建方向。使用光学显微镜和EBSD测量值对微结构进行了表征。使用涡流方法以及四探针方法测量电导率,同时使用Vickers微硬度和拉伸机械测试评估机械性能。根据微观结构的特征,讨论了电气和机械性能,并与经过退火处理的冷工作的Cu-ETP纸进行了比较。它表明,E-PBF能够可靠地产生由纯铜制成的组件,其性质等于由更常规的加工路线制造的纯铜,而不管构建方向如何。
Electrical conductors are usually made of pure copper because this material shows outstanding electrical conductivity (IACS > 100%). Additive manufacturing can be used to further improve the performances of such electrical conductors because it enables to consider sophisticated geometries impossible to be fabricated by conventional processing routes such as casting, machining or hot forming. In the present work, Electron Beam Powder Bed Fusion is optimized to achieve dense pure copper specimens (relative density >99.9%). Only few residual spherical pores inherited from the as-received powder particles are detected in the samples as nicely revealed by X-ray microtomography scans. Three different build orientations, namely 0{\textdegree}, 45{\textdegree} and 90{\textdegree} with respect to the build direction are produced. The microstructures are characterized using optical microscopy and EBSD measurements. The electrical conductivity is measured using the Eddy current method as well as the four-probes method while the mechanical properties are assessed using Vickers microhardness and tensile mechanical testing. The electrical and mechanical performances are discussed in the light of the microstructural characterizations, and further compared with a cold-worked Cu-ETP sheet subjected to an annealing treatment. It demonstrates that E-PBF is able to reliably produce components made of pure Copper whose properties equal those of pure copper fabricated by more conventional processing routes, regardless of the build orientation.